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Growing Demand for Thermography Software Will Significantly Augment the Global Infrared Thermography Market Through 2020, Says Technavio
[June 24, 2016]

Growing Demand for Thermography Software Will Significantly Augment the Global Infrared Thermography Market Through 2020, Says Technavio


According to the latest research report released by Technavio, the global infrared thermography market is expected to grow steadily at a CAGR of over 10% until 2020.

This report titled 'Global Infrared Thermography Market 2016-2020', provides an in-depth analysis of the market in terms of revenue and emerging trends. The report also provides segmentation based on application, technology, and geography.

Request sample report: http://bit.ly/1YoNsRG

"Global die casting machinery manufacturers are slowly incorporating various simulation-based software solutions in their offerings to cater to the needs of end-user who require cast parts with exact dimensions of size, weight, and shape to be used in the manufacturing process. This encourages die casting machinery manufacturers to adopt simulation-based castings that can create defect-free castings during the manufacturing process," said Sunil Kumar Singh, one of Technavio's lead industry analysts for embedded systems.

Some of the other driving forces behind the growth of the global infrared thermography market are as follows:

  • Development of crystal growth techniques
  • Improvement in topologies for photon absorption
  • Evolution of IR FPAs

Development of crystal growth techniques

IR thermography used in military applications has to operate in a wide band ranging from SWIR to VLWIR (0.3 to 30 microns). Also, low cost and high performance detectors are required for commercial applications. As a result, manufacturers with in-house manufacturing facilities are focusing on the development of crystal growth technologies, where large diameter wafers are being produced with low defect densities. Bulk crystal growth, metal-organic chemical vapor deposition (MOCVD), liquid phase epitaxy (LPE), and molecular beam epitaxy (MBE) are key crystal growth techniques being employed. With these techniques, vendors are able to manufacture low-cost IR detectors like bolometer (micro bolometer array), mercury-cadmium-tellurium (MCT) arrays, and various other band gap devices based on III-V compound semiconductors. In military applications, MCT (Hg 1-x Cd x Te) is the most preferred IR detector as it has the ability to energize its band gap from semimetal (HgTe) to a wider band gap semiconductor (CdTe) by varying the composition of Cd. It provides higher absorption, resulting in better quantum efficiency.



Improvement in topologies for photon absorption

Using special pyramidal and pillar topologies in the photon absorbing layers, vendors have been able to design broadband operations in a single IR detector used in IR thermography; thus, eliminating the need for multiple cameras. In addition, the broadband technology enables hyper spectral sensing capacity, i.e., increasing the operating range at 200K compared to traditional 80K. Hence, large and high power coolers can be replaced with low power and miniature size coolers. Vendors are focusing on improving key features such as wide field of view, pixel pitch, resolution, multicolor, form factor, and low SWaP. For instance, Microsystems Technology Office (MTO) of the US Defense Advanced Project Agency (DARPA) developed two programs namely, advanced wide field-of-view architectures for image reconstruction and exploitation (AWARE) and low cost thermal imager-manufacturing (LCTIM).


Evolution of IR FPAs

The global IR thermography market is highly dependent on IR detectors, which quantifies the thermal heat radiation emitted by an object. Thermal sensors are sensitive to a range of radiations lying within the IR wavelength. In late 1890s, the main technology used was thermocouples and bolometers. Now, the technology has evolved to FPAs, which include first generation detector arrays for linear array of scanning systems and second generation detector arrays for two-dimensional array of starring systems. The global IR sensors market was driven by increased demand for military applications like missile seekers and forward looking IR (FLIR) sensors. The first generation FPAs were limited by size and performance, which was overtaken by second generation thermal imaging systems. The second generation thermal imaging systems use high density FPAs, with on-chip processing, which helps in the integration of many detectors, low noise multiplexing, and on chip signal processing by time delay integration (TDI (News - Alert)), thereby enhancing performance and flexibility.

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About Technavio

Technavio is a leading global technology research and advisory company. The company develops over 2000 pieces of research every year, covering more than 500 technologies across 80 countries. Technavio has about 300 analysts globally who specialize in customized consulting and business research assignments across the latest leading edge technologies.

Technavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, re-sellers, and end-users.

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