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TMCNet: Design Analysis Nokia Siemens Networks Flexi W-CDMA 2100MHz RF Module Model 082849A.103 FSMB Core

[February 11, 2010]

Design Analysis Nokia Siemens Networks Flexi W-CDMA 2100MHz RF Module Model 082849A.103 FSMB Core

(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets (http://www.researchandmarkets.com/research/5cb58e/design_analysis_no) has announced the addition of EJL Wireless Research's new report "Design Analysis Nokia Siemens Networks Flexi W-CDMA 2100MHz RF Module Model 082849A.103 FSMB Core" to their offering.

This report covers the design analysis of an Nokia Siemens Networks Flexi W-CDMA 2100MHz RF Module Model 082849A.103 FSMB Core. This unit is an integral part of a Flexi W-CDMA base transmitting station (BTS). The unit was manufactured in mid 2007.

The following semiconductor & passive component suppliers are included in this report: Altera, AMCC, Analog Devices, Cortina Systems, Cypress Semiconductor, Emerson/Artesyn Technologies, Fairchild Semiconductor, IDT, International Rectifier, Lattice Semiconductor, Linear Technology, Marvell, Maxim Integrated Products, Micron, National Semiconductor, NEC, NXP Semiconductor, Samsung Electric, Spansion STMicroelectronics, Texas Instruments, Vishay Semiconductors, Xilinx, Zarlink Semiconductor Features - Complete Part Number/Marking - Component Manufacturer Identification - Function Component Description - Package Type - Total Pages: 72 - Total Tables: 14 - Total Exhibits: 63 Important Note: There is NO component pricing contained within the report Key Topics Covered: EXECUTIVE SUMMARY Active/Passive Component Summary CHAPTER 1: FLEXI W-CDMA NODEB SYSTEM 1.1 Overview of Nokia Siemens Networks Flexi NodeB Platform CHAPTER 2: MECHANICAL ANALYSIS 2.1 Exterior Mechanical Analysis CHAPTER 3: DIGITAL BASEBAND SUBSYSTEM (RRU) 3.1 RRU Sector BBU System 3.2 Area A: FPGA/Microprocessor Section 3.3 Area B: DSPs/ASICs for Chip Rate/Symbol Rate Processing Section 3.4 Area C: SRAM Memory Section 3.5 Area D: FPGA/Microprocessor Support Section 3.6 1/8 Brick 75W DC-DC Converter Module 3.7 22W DC-DC Converter Module 3.8 55W DC-DC Converter Module CHAPTER 4: DIGITAL BASEBAND SUBSYSTEM (MAIN NODEB) 4.1 NodeB BBU System 4.2 Area E: Ethernet Transport Section 4.3 Area F: RRU Interface Section 4.4 Area G: FPGA/ASIC/Microprocessor Support Section 4.5 Area H: Ethernet Transport Support Section CHAPTER 5: POWER ENTRY MODULE CHAPTER 6: COOLING FAN UNIT APPENDIX A - PASSIVE CASE SIZE ANALYSIS APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS Companies Mentioned: - Altera - AMCC - Analog Devices - Cortina Systems - Cypress Semiconductor - Emerson/Artesyn Technologies - Fairchild Semiconductor - IDT - International Rectifier - Lattice Semiconductor - Linear Technology - Marvell - Maxim Integrated Products - Micron - National Semiconductor - NEC - NXP Semiconductor - Samsung Electric - Spansion STMicroelectronics - Texas Instruments - Vishay Semiconductors - Xilinx - Zarlink Semiconductor For more information visit http://www.researchandmarkets.com/research/5cb58e/design_analysis_no ((Comments on this story may be sent to info@m2.com)) (c) 2010 M2 COMMUNICATIONS

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