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TMCNet: HiSilicon, a Division of Huawei, Licenses Tensilica's Xtensa Dataplane Processor and ConnX DSP IP Cores

[February 09, 2010]

HiSilicon, a Division of Huawei, Licenses Tensilica's Xtensa Dataplane Processor and ConnX DSP IP Cores

(Market Wire Via Acquire Media NewsEdge) SCHENZEN, CHINA -- (MARKET WIRE) -- 02/09/10 -- Tensilica®, Inc. announced today that HiSilicon Technologies has licensed Tensilica's Xtensa® customizable dataplane processors (DPUs) and ConnX? DSP (digital signal processing) semiconductor IP cores. HiSilicon will use Tensilica's DPUs and DSPs in network equipment chip design.

"We conducted a thorough review and evaluation of licensable DSP IP cores before selecting Tensilica," stated Teresa He, Vice President of HiSilicon.

"Tensilica's unique ability to combine world-class DSP capability with the flexibility and customization of the Xtensa DPUs gives HiSilicon the opportunity to strongly differentiate our products. We feel this will give us a strong competitive advantage." "We are pleased that HiSilicon, a world leader in mobile wireless, has selected Tensilica's DPUs and ConnX DSP cores," stated Tensilica president and CEO Jack Guedj. "Their data-intensive, high-throughput and power efficient applications are an ideal match for our customizable DPUs." About HiSilicon Technologies HiSilicon provides ASICs and solutions for communication network and digital media. These ASICs are widely used in over 100 countries and regions around the world. In the digital media field, HiSilicon has already released the SoC and solution for network surveillance, videophone, DVB and IPTV. For more information see www.hisilicon.com.

About Tensilica Tensilica, Inc. -- the leader in customizable dataplane processors -- is a semiconductor IP licensor recognized by the Gartner Group as the fastest growing semiconductor IP supplier in 2008. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10-to-100-times the performance because they can be customized using Tensilica's automated design tools to meet specific dataplane performance targets. Tensilica's DPUs power SOC designs at system OEMs and five out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

Editors' Notes: -- Tensilica and Xtensa are registered trademarks belonging to Tensilica Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.

-- Tensilica's announced licensees include: ADDMM, Afa Technologies, ALPS, Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay Microsystems, Blue Wonder, Brocade, Broadcom, Cisco Systems, CMC Microsystems, Conexant Systems, Design Art Networks, DS2, EE Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Fujitsu Microelectronics Ltd., HiSilicon (a division of Huawei), Hudson Soft, iBiquity Digital, Ikanos Communications, IDT, Intel, Juniper Networks, LG Electronics, Lucid Information Technology, Marvell, NEC Laboratories America, NEC Corporation, Neterion, Nethra Imaging, Nippon Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical Co.

Ltd., Panasonic Mobile, Penstar, Plato Networks, PnpNetwork Technologies, PowerLayer Microsystems, Samsung, SiBEAM, Sony, STMicroelectronics, Stretch, TranSwitch Corporation, Triductor Technology, UpZide, Valens Semiconductor, Validity Sensors, Victor Company of Japan (JVC), WiLinx, and XM Radio.

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