Wireless Infrastructure - CEVA Expands Into 4G Wireless Infrastructure Market
October 20, 2010
By Anil Sharma, TMCnet Contributor
CEVA, Inc, a licensor of silicon intellectual property (SIP) platform solutions and DSP cores, have introduced the CEVA (News - Alert)-XC323, which the company claims to be the industry's first high performance vector DSP for 4G wireless infrastructure applications.
Officials with CEVA said that the CEVA-XC323 delivers up to 4x performance improvement in wireless infrastructure applications compared to incumbent infrastructure VLIW DSPs, such as those offered by Texas Instruments (News - Alert), and lowers the overall bill-of-materials by significantly reducing the number of processors and hardware accelerators required.
According to company officials, the CEVA-XC323 is already in design with a wireless infrastructure vendor for 4G Software Defined Radio (SDR) base-station applications.
Company officials said that the CEVA-XC323 is scalable to address the complete range of cell site solutions required by network operators, including femtocells, picocells, microcells and macrocells.
The architecture, company officials said, leverages the widely-adopted CEVA-X DSP engine which has shipped in more than 100 million devices to date, including advanced wireless infrastructure equipment and wireless handsets from the world's leading OEMs.
The CEVA-XC323 integrates two high-precision vector communication units specifically designed to cope with the heavy processing load found in base-stations and supports homogenous multi-core designs commonly used in modern infrastructure architectures.
"The CEVA-XC323 DSP is a game changer in the 4G wireless infrastructure space and represents an important milestone in CEVA's evolutionary growth strategy beyond our stronghold of the wireless terminal market," said Gideon Wertheizer, CEO of CEVA, in a statement.
Wertheizer said that incumbent infrastructure DSP vendors have relied upon an inefficient combination of traditional VLIW DSP architectures and hardware blocks to compensate for the lack of DSP performance.
He said that this result in complicated software design, limited platform reuse across different products, and essentially locks the OEM to the DSP supplier.
“With the introduction of the CEVA-XC323 DSP, our customers can apply software defined radio technologies to improve performance, flexibility and time-to-market for their infrastructure processor designs,” he said.
Wertheizer said that for the OEM, the inherent benefits of the company’s IP licensing model include the ability to source chips from multiple vendors and the option to license the CEVA-XC323 DSP directly and manufacture chips at any foundry.
Anil Sharma is a contributing editor for TMCnet. To read more of his articles, please visit his columnist page.
Edited by Stefanie Mosca