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February 16, 2011

CEVA Signs Agreement with NEC CASIO

CEVA Inc., a licensor of silicon intellectual property (SIP) platform solutions and DSP cores, has recently announced that the company has signed an agreement with NEC CASIO Mobile Communications.

CEVA will undertake joint research into the development of cellular modem technologies targeting next generation wireless baseband standards with NEC CASIO. Together the companies will analyse closely the processing requirements, target performance and system layout of next generation modems. CEVA will be participating in the 2011 Mobile World Congress.

Wireless baseband technologies includes HSPA+, WiMAX and LTE, are quickly evolving fast through multiple 3G and 4G standards into next generation wireless modems. The modems will be required to address the dramatically growing complexity in multiple aspects such as download and upload peak data rates, antenna scheme, spatial multiplexing and synchronization.

CEVA’s solutions have been designed for the mobile handset, portable and consumer electronics markets and its IP portfolio includes comprehensive technologies for cellular baseband 2G, 3G and 4G, multimedia, HD video and audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA).

The partnership with NEC CASIO Mobile Communications will prove advantageous to both the companies as NEC CASIO provides innovative mobile handsets for major wireless providers in Japan and the U.S.A region.

CEVA’s DSP technology has powered seven out of eight of the world’s top handset OEMs including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE, with the CEVA-powered baseband processors. CEVA’s IP has been shipped to more than 600 million devices.

CEVA’s DSP addresses the next-generation 4G terminal and infrastructure markets, and the CEVA-XC has been specifically designed to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance Software Defined Radio multimode solutions, said the company. It supports multiple air interfaces in software, including LTE-A, LTE, TD-LTE, WiMAX 16m, HSPA+, HSPA, TD-SCDMA, GSM and CDMA.

In a release, CEO of CEVA, Gideon Wertheizer, said, "CEVA is honoured to collaborate with NEC CASIO Mobile Communications for future wireless baseband technologies. As the world's number one DSP architecture deployed in wireless baseband processors, we have an innate understanding of how to successfully address the growing complexity of modem processing and deliver industry-leading solutions."


Carolyn John is a Contributor to MobilityTechzone. To read more of her articles, please columnist page.

Edited by Janice McDuffee


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