Swiss-based provider of wireless and positioning semiconductors, software and solutions, u-blox, has begun collaborating with Intel Corporation to produce a small, cost-effective 3G-only HSPA module. The aim of this module is to facilitate product diversity and smooth migration while still staying cost effective by way of reduced design, test, logistics and certification costs.
As the module will be based on Intel's XMM 6255 HSPA modem platform and packaged in a compact, low-cost module that is compatible with u-blox SARA 2G and LISA 3G series modules, it will easily achieve its migration and cost goals. Indeed, the u-blox nested design philosophy allows product designers to create tailored solutions to their target markets, all based on a single PCB design.
“As operators start to sunset their GSM/GPRS services, we have partnered with Intel to bring the cost of 3G connectivity down,” said Nikolaos Papadopoulos, president of u-blox America. “For 3G-only M2M devices, our compact HSPA-only module, which is about the size of a quarter, is layout compatible with our popular SARA GSM/GPRS wireless module series. This is the perfect combination for the North American market.”
Earlier in May, u-blox attained "Certified M2M Hardware" status from Vodafone for the LISA-U200 and LISA-230 6-band UMTS/HSPA+ module series, as well as the LISA-U270 dual-band module, enabling global customers to design LISA-U2 modems into M2M devices that operate on Vodafone's network.
The new module from u-blox and Intel has more to offer than easy migration and low cost, according to Horst Pratsch, head of product line modules and M2M at Intel Corporation, thanks to the XMM 6255 platform's innovative design. Designed specifically for M2M, this platform integrates the 3G power amplifier in the transceiver to deliver the smallest possible size and a lower number of components, allowing it to enable new applications of 3G in M2M.
The XMM 6255 is currently the world's smallest available HSPA modem chipset.
Edited by
Alisen Downey 
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