Feature Article

September 15, 2011

Sequans' LTE Semiconductor Technology now Qualified for Use in China's LTE Networks

China’s Ministry of Industry and Information Technology (MIIT) has officially approved LTE semiconductor technology from Sequans Communications, a 4G chipmaker, supplying LTE and WiMAX chips to original equipment manufacturers and original design manufacturers worldwide.

MIIT is a government entity of China and is responsible for the regulation and development of that country’s wireless industry. Its approval signifies that Sequans’ technology is qualified for use in LTE networks in China.

“We now have the MIIT stamp of approval which we believe signals our readiness for worldwide deployment,” said Georges Karam, CEO of Sequans

Sequans’ LTE semiconductor solution has been undergoing testing for several months. Simultaneous, it has been interoperating with system vendors such as Huawei and Alcatel-Lucent Shanghai Bell, which is Alcatel-Lucent’s Chinese subsidiary. 

Karam said that the company has been working toward this ever since China Mobile asked ir to provide technology for their first TD-LTE demonstration network at the World Expo 2010 in Shanghai.

The successful passing of the tests indicates that Sequans’ technology supports the MIIT performance and interoperability requirements necessary for the technology to be used in the field.

In both 2.3 and 2.6 GHz bands, the MIIT performance and interoperability testing was conducted. Company officials said that the chip used in the tests was Sequans’ SQN3010 TD-LTE baseband chip. 

Sequans has also completed LTE interoperability testing on a private basis with Ericsson, Nokia Siemens Networks, ZTE and other network vendors.

“We look forward to participating in the large scale trials and future commercial deployments of China Mobile and other LTE operators who now have confirmation of the maturity of Sequans’ LTE solutions,” Karam said.

Last month, Sequans entered into an exclusive licensing agreement with NetComm Limited to supply an advanced semiconductor solution for TD-LTE connectivity.

Anshu Shrivastava is a contributing editor for MobilityTechzone. To read more of Anshu’s articles, please visit her columnist page.

Edited by Jennifer Russell

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