Feature Article

October 05, 2011

Softbank Mobile Uses LTE Chipset from Altair Semiconductor

Softbank Mobile used Altair Semiconductor’s FourGee LTE chipset, integrated in a commercial USB dongle, for its 4G press conference AXGP demonstration conducted in Japan on September 29, 2011.

Advanced eXtended Global Platform or AXGP is a Japanese 4G standard that is fully compliant with the TD-LTE specification.

Altair Semiconductor is a developer of ultra-low power, small footprint and high performance 4G LTE chipsets.

Last month the company introduced its TD-LTE chipset, integrated in a commercial USB dongle. Altair claimed this chipset achieved download speeds of more than 100Mbps in a live over-the-air demonstration. 

Altair has begun the shipment of one of the first commercial TDD/FDD LTE chipsets in the market and claims to have established a strong leadership position in the emerging TD-LTE market.

China’s Ministry of Industry and Information Technology (MIIT) has also officially approved Altair’s first commercial TDD/FDD LTE chipset for use in LTE networks in the country.

This chipset, claims Altair China, has been selected by more than 15 ODM/OEM vendors globally and has been in mass production for over a year now.

"Altair’s LTE chipset is an industry benchmark – both when it comes to performance and maturity," said Eran Eshed, co-founder and VP of Marketing and Business Development at Altair Semiconductor.

"We are pleased that our market-ready FourGee LTE chipset, integrated in a fully commercialized USB dongle device, was selected by Softbank to power the world’s fastest 4G TDD network, and we look forward to continue demonstrating the power of our chipsets in 4G networks around the world." 

Read a related article at MobilityTechzone “Lantiq and Altair Semiconductor Launch Broadband Wireless LTE.”


Anuradha Shukla is a contributing editor for MobilityTechzone. To read more of her articles, please visit her columnist page.

Edited by Rich Steeves


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