Global Mobile WiMAX solutions supplier,
GCT Semiconductor, has announced it is leveraging a range of
MIPS Technologies’ (MIPS) advanced Analog Front Ends (AFEs) to support highly-integrated single-chip and chipset solutions for Mobile WiMAX and WiFi connectivity.
GCT has integrated a number of the MIPS AFEs for wireless broadband communications into products that are already shipping. The company also recently added a new AFE from MIPS Technologies to its portfolio.
Praising MIPS Technologies’ AFEs, GCT Semiconductor vice president of Product Development Larry Dano said that these solutions provide them with high performance and versatility. In addition, the robustness of their underlying converter technology allows seamless integration and operation of the AFE inside GCT’s complex SoCs.
GCT and MIPS have been in a successful business relationship for the past five years. Dano noted that throughout this period, MIPS was always available and responsive to requests and collaborated closely with the GCT design team.
“We are pleased that GCT has reaffirmed its commitment to MIPS through this latest engagement,” said Joao Vital, vice president of data conversion solutions, Analog Business Group, MIPS Technologies. He also expressed their company’s commitment to helping ensure the continuing success of GCT’s designs.
For this latest contract, MIPS AFEs have been integrated into highly-integrated WiMAX and WiFi single chips and chipsets for PCs, PDAs, phones and other devices with wireless broadband communications functionality.
According to company’s sources, the MIPS AFEs are integrated into several GCT products including the GDM7215 single-chip WiMAX plus WiFi integrated circuit; the GDM7205 mobile WiMAX 2.5 GHz Wave 2 single chip; and the GDM7201 WiMAX chipset.
MIPS Technologies, Inc., is a provider of industry-standard architectures, processors and analog IP for digital consumer, home networking, wireless, communications and business applications. The company’s 40nm USB 2.0 High-Speed PHY IP
recently achieved certification from the USB Implementers Forum (USB-IF) and met TSMC's TSMC9000 standards in its 40nm LP process.
Anuradha Shukla is a contributing editor for MobilityTechzone. To read more of Anuradha’s article, please visit her columnist page.Edited by
Stefania Viscusi